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Category: ATTRACT Media news
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Compound SemiconductorUK memory start-up Quinas wins WIPO award
Lancaster University memory spinout company Quinas Technology has won a 2025 World Intellectual Property Organisation (WIPO) Global Award. Selected from a pool of more than 780 applicants across 95 countries, Quinas was recognised for its patented ULTRARAM technology, which uses compound semiconductors (GaSb, InAs and AlSb) to combine the speed of DRAM and the non-volatility […]
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VoxelMattersCSEM develops a 3D printed thermal control system for satellites
CSEM, in collaboration with Thales Alenia Space and Lisi Aerospace Additive Manufacturing, has created an innovative 3D printed pipe segment for advanced thermal management systems in satellites. The part was displayed at the LISI Aerospace booth during the Paris Air Show.
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NewelectronicsIQE and Quinas Technology complete £1.1m ULTRARAM industrialisation project
IQE, a supplier of compound semiconductor wafer products and advanced material solutions, and Quinas Technology have successfully completed a project to develop scalable production of ULTRARAM, the world’s first quantum-powered universal memory.
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Compound SemiconductorIQE and Quinas complete £1.1m ULTRARAM scale-up project
Compound semiconductor wafer company IQE plc and Quinas Technology, a British semiconductor company, have completed a £1.1 million Innovate UK-funded joint project to develop a scalable production method for the world’s first quantum-powered universal memory ULTRARAM.
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Science BusinessState aid rules are slowing down knowledge valorisation, say universities
Universities are calling for EU state aid rules to be clarified and for exemptions to be introduced to make it simpler for them to collaborate with industry.
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Laser Focus WorldBlack germanium boosts infrared photodiode responsivity
Researchers create a germanium infrared photodiode that’s 35% more responsive at 1.55 µm—a common wavelength for telecommunications—than its other germanium and indium gallium arsenide counterparts.
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3printr3D-printed pipe segment combines heating and sensor for satellites
The Swiss Technology Innovation Center (CSEM), in collaboration with LISI Aerospace Additive Manufacturing and Thales Alenia Space France, has developed a 3D-printed tube segment that combines heating elements and temperature sensors. The component was designed as part of the EU project AHEAD (Advanced Heat Exchange Devices).
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El EspañolEl investigador español que quiere darle un giro de 180 grados a las pantallas gracias a las membranas de grafeno (in Spanish)
Santiago Cartamil-Bueno es físico pero, tras su periplo académico, se decidió a emprender en una ‘deep tech’ con sede en Valencia y residencia en Estonia. Cartamil el coordinador del proyecto MEGAMORPGH.
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Science BusinessATTRACT: Using experimentation to boost University-Industry collaboration
A study led by the NEXT project highlights how structured experimentation can help design more effective collaboration programs, providing data-driven insights to optimize the engagement of researchers and businesses.